CY8C3866AXI-040 | 赛普拉斯半导体

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CY8C3866AXI-040
Status: 生产中

数据手册

(pdf, 4.72 MB) RoHS PB Free
(pdf, 4.66 MB) RoHS PB Free

CY8C3866AXI-040

Development KitCY8CKIT-001
合格汽车
Boost Converter (Volts)0.5
CPU Core8051
CapSense
专用模数转换器(#_ 最大分辨率 @ 采样速率)DelSig (1, 20-bit @ 180 sps)
专用数模转换器(编号_最大分辨率 @ 采样速率)(4、8-bit @ 8 msps)
EEPROM (KB)2
闪存 (KB)64
JTAG and Si ID0x1E028069
LCD 直接驱动(是/否)
最高工作频率 (MHz)67
最高工作温度 (°C)85
最高工作电压 (V)5.50
最低工作温度 (°C)-40
最低工作电压 (V)1.71
No. of CAN Controllers1
No. of DMA Channels24
No. of Dedicated Comparators4
No. of Dedicated Digital Filter Blocks1
No. of Dedicated I2C1
No. of Dedicated OpAmps4
No. of Dedicated SPI0
No. of Dedicated Timer/Counter/PWM Blocks4
No. of Dedicated UART0
GPIO 编号62
可编程模拟模块编号4
可编程通用数字模块编号24
No. of USB IO2
SRAM (KB)8
Tape & Reel
USB (Type)全速

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$13.73 $13.15 $12.58 $12.00 $11.42 $10.46
Availability Quantity Ships In Buy from Cypress Buy from Distributors
In Stock 207 24-48 hours

Packaging/Ordering

工具包
QFP
No. of Pins
100
Package Dimensions
551 L x 55 H x 551 W (Mils)
Package Weight
637.75 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
900
Minimum Order Quantity (MOQ)
90
Order Increment
90
Estimated Lead Time (days)
728
HTS Code
8542.31.0001
ECCN
(A.3)
ECCN Suball
3A991

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
符合有害物质限制 (RoHS) 标准
无铅
Lead/Ball Finish
Pure Sn;Ni/Pd/Au

技术文档

技术参考手册(2)

2020 年 5 月 28 日
2020 年 5 月 28 日

应用笔记 (39)

2017 年 8 月 01 日
2017 年 5 月 25 日

产品变更通知 (PCN) (7)

2020 年 12 月 07 日
Qualification of UBOT Tray for 100-Lead TQFP 14x14x1.4mm Products at ASE-KH Finish Site
2018 年 5 月 28 日
Transfer of package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET) for select products
2017 年 10 月 31 日
Q2, 2012 - Q4, 2013 Horizon Report
2017 年 10 月 30 日
Q1, 2012 - Q2, 2013 Horizon Report
2017 年 10 月 25 日
Qualification of Copper Palladium Wire Bonds for Select Lead Frame Products at JCET China
2017 年 10 月 25 日
Addendum to PCN 135245: Qualification of Manufacturing and Design Changes for PSoC 3 Products
2017 年 10 月 24 日
Qualification of Manufacturing and Design Changes for PSoC 3 Products

Advanced Product Change Notice (APCN) (2)

2021 年 3 月 08 日
2021 Annual Horizon Report
2020 年 8 月 23 日
Q32020 Horizon Report Update

Product Information Notice (PIN) (1)

2017 年 10 月 26 日
Datasheet changes-PSoC 3 Products

Programming Specifications (1)

边界扫描 BSDL (2)

2012 年 12 月 10 日
2011 年 4 月 06 日

BSDL (4)