CY8C5866AXI-LP021 | 赛普拉斯半导体
CY8C5866AXI-LP021
| Development Kit | CY8CKIT-050 |
| 合格汽车 | 否 |
| 专用模数转换器（#_ 最大分辨率 @ 采样速率） | DelSig (1, 20-bit @ 180 sps), SAR (1, 12-bit @ 1000 ksps) |
| 最高工作温度 (°C) | 85 |
| 最高工作电压 (V) | 5.50 |
| 最低工作温度 (°C) | -40 |
| 最低工作电压 (V) | 1.71 |
| Part Family | PSoC 5LP |
| Tape & Reel | 否 |
Pricing & Inventory Availability
| 1-9 unit Price* | 10-24 unit Price* | 25-99 unit Price* | 100-249 unit Price* | 250-999 unit Price* | 1000+ unit Price* |
|---|---|---|---|---|---|
| $11.91 | $11.41 | $10.91 | $10.41 | $9.91 | $9.08 |
Packaging/Ordering
工具包
No. of Pins
100
Package Dimensions
551 L x 55 H x 551 W (Mils)
Package Weight
637.75 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
900
Minimum Order Quantity (MOQ)
90
Order Increment
90
Estimated Lead Time (days)
182
HTS Code
8542.31.0001
ECCN
(A.3)
ECCN Suball
3A991.A.3
Quality and RoHS
Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
260 (Cypress Reflow Profile)
符合有害物质限制 (RoHS) 标准
无铅
是
Lead/Ball Finish
Pure Sn;Ni/Pd/Au
Marking
IPC 1752 材料成分声明
Last Update: 2020 年 10 月 26 日
Last Update: 2019 年 10 月 30 日
技术文档
应用笔记 (8)
2021 年 3 月 02 日
产品变更通知 (PCN) (4)
2020 年 12 月 07 日
Qualification of UBOT Tray for 100-Lead TQFP 14x14x1.4mm Products at ASE-KH Finish Site
2020 年 5 月 6 日
Qualification of Fab 25 as an Additional Wafer Fab Site and Test 25 as an Additional Wafer Sort Site for PSoC® 5 LP Product Family
2017 年 10 月 25 日
Qualification of Copper Palladium Wire Bonds for Select Lead Frame Products at JCET China
Product Information Notice (PIN) (5)
2020 年 4 月 14 日
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization
2017 年 11 月 06 日
GSMC Merger with HH-NEC to Form HHGrace Semiconductor Manufacturing Corporation
2017 年 11 月 06 日
Improvement of Cypress Minnesota Back-End-of-Line Integration for 130nm SONOS Product Families
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