CY8C5866AXI-LP021 | 赛普拉斯半导体
CY8C5866AXI-LP021
| Development Kit | CY8CKIT-050 |
| 合格汽车 | 否 |
| Boost Converter (Volts) | 0.5 |
| CPU Core | ARM Cortex-M3 |
| CapSense | 是 |
| 专用模数转换器（#_ 最大分辨率 @ 采样速率） | DelSig (1, 20-bit @ 180 sps), SAR (1, 12-bit @ 1000 ksps) |
| 专用数模转换器（编号_最大分辨率 @ 采样速率） | （4、8-bit @ 8 msps） |
| EEPROM (KB) | 2 |
| 闪存 (KB) | 64 |
| LCD 直接驱动（是/否） | 是 |
| 最高工作频率 (MHz) | 67 |
| 最高工作温度 (°C) | 85 |
| 最高工作电压 (V) | 5.50 |
| 最低工作温度 (°C) | -40 |
| 最低工作电压 (V) | 1.71 |
| No. of CAN Controllers | 0 |
| No. of DMA Channels | 24 |
| No. of Dedicated Comparators | 4 |
| No. of Dedicated Digital Filter Blocks | 1 |
| No. of Dedicated I2C | 1 |
| No. of Dedicated OpAmps | 2 |
| No. of Dedicated SPI | 0 |
| No. of Dedicated Timer/Counter/PWM Blocks | 4 |
| No. of Dedicated UART | 0 |
| GPIO 编号 | 62 |
| 可编程模拟模块编号 | 4 |
| 可编程通用数字模块编号 | 20 |
| No. of SIO | 8 |
| No. of USB IO | 2 |
| Part Family | PSoC 5LP |
| SRAM (KB) | 16 |
| Series | PSoC 5800 |
| Tape & Reel | 否 |
| USB (Type) | 全速 |
Pricing & Inventory Availability
| 1-9 unit Price* | 10-24 unit Price* | 25-99 unit Price* | 100-249 unit Price* | 250-999 unit Price* | 1000+ unit Price* |
|---|---|---|---|---|---|
| $11.91 | $11.41 | $10.91 | $10.41 | $9.91 | $9.08 |
Packaging/Ordering
工具包
No. of Pins
100
Package Dimensions
551 L x 55 H x 551 W (Mils)
Package Weight
637.75 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
90
Minimum Order Quantity (MOQ)
90
Order Increment
90
Estimated Lead Time (days)
126
HTS Code
8542.31.0001
ECCN
(A.3)
ECCN Suball
3A991.A.3
Quality and RoHS
Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
260 (Cypress Reflow Profile)
符合有害物质限制 (RoHS) 标准
无铅
是
Lead/Ball Finish
Ni/Pd/Au, Ni/Au
Marking
IPC 1752 材料成分声明
Last Update: 2019 年 7 月 31 日
Last Update: 2016 年 10 月 20 日
Last Update: 2016 年 10 月 19 日
Device Qualification Reports
FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.
Last Update: 2016 年 9 月 16 日
技术文档
应用笔记 (8)
2019 年 10 月 02 日
产品变更通知 (PCN) (3)
2017 年 10 月 25 日
Qualification of Copper Palladium Wire Bonds for Select Lead Frame Products at JCET China
Product Information Notice (PIN) (3)
2017 年 11 月 06 日
GSMC Merger with HH-NEC to Form HHGrace Semiconductor Manufacturing Corporation
2017 年 11 月 06 日
Improvement of Cypress Minnesota Back-End-of-Line Integration for 130nm SONOS Product Families