CY9AF111NABGL-GE1 | 赛普拉斯半导体
CY9AF111NABGL-GE1
| 合格汽车 | 否 |
| 最高工作温度 (°C) | 70 |
| 最高工作电压 (V) | 5.50 |
| 最低工作温度 (°C) | 0 |
| 最低工作电压 (V) | 1.10 |
| Part Family | FM3 |
| Part Family | FM3 |
| Tape & Reel | 否 |
Pricing & Inventory Availability
| 1-9 unit Price* | 10-24 unit Price* | 25-99 unit Price* | 100-249 unit Price* | 250-999 unit Price* | 1000+ unit Price* |
|---|---|---|---|---|---|
| $9.65 | $8.69 | $7.91 | $7.14 | $6.56 | $5.21 |
Packaging/Ordering
Quality and RoHS
Moisture Sensitivity Level (MSL)
Peak Reflow Temp. (°C)
符合有害物质限制 (RoHS) 标准
无铅
是
Lead/Ball Finish
Sn-3Ag-0.5Cu
Marking
技术文档
应用笔记 (17)
产品变更通知 (PCN) (2)
2020 年 5 月 28 日
Addendum to PCN201303 - Qualification of Amkor Technology Japan Kumamoto as an Assembly Site and Die Attach Material Change for Select MCU Products
2020 年 3 月 29 日
Qualification of Amkor Technology Japan Kumamoto as an Assembly Site and Die Attach Material Change for Select MCU Products
Advanced Product Change Notice (APCN) (7)
2020 年 4 月 14 日
Planned Qualification of J-Devices Usuki for 300mm DPS Process and J-Devices Kumamoto for BGA Assembly and Test Site for Select Analog and MCU Products
2020 年 4 月 14 日
Addendum to APCN173705A - Planned Qualifications of Fab 25 and SMIC Fab B1 as Additional Wafer Fab Sites and a New Bill of Materials at J-Devices for Select MCU and Analog Products
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