CY9AF112KQN-G-AVE2 | 赛普拉斯半导体

CY9AF112KQN-G-AVE2

合格汽车
最高工作温度 (°C)70
最高工作电压 (V)5.50
最低工作温度 (°C)0
最低工作电压 (V)1.10
Part FamilyFM3
Part FamilyFM3
Tape & Reel

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$9.65 $8.69 $7.91 $7.14 $6.56 $5.21
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

No. of Pins
48
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
1
Minimum Order Quantity (MOQ)
260
Order Increment
260
Estimated Lead Time (days)
182
HTS Code
8542.31.0001
ECCN Suball
3A991.A.3

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
符合有害物质限制 (RoHS) 标准
无铅
Lead/Ball Finish
Pure Sn

技术文档

应用笔记 (19)

产品变更通知 (PCN) (1)

2020 年 4 月 14 日
Qualification of Amkor Technology Japan Kumamoto for Test Site for Select Analog and MCU Products

Advanced Product Change Notice (APCN) (9)

2020 年 8 月 23 日
Q32020 Horizon Report Update
2020 年 7 月 21 日
Q32020 Automotive Horizon Report Update
2020 年 4 月 22 日
Q220 Automotive Horizon Report Update
2020 年 4 月 22 日
Q220 Standard Horizon Report Update
2020 年 4 月 14 日
2020 Annual Horizon Report Update
2020 年 4 月 14 日
Q419 Horizon Report Update
2020 年 4 月 14 日
Planned Qualification of J-Devices Usuki for 300mm DPS Process and J-Devices Kumamoto for BGA Assembly and Test Site for Select Analog and MCU Products
2020 年 4 月 14 日
Q319 Horizon Report Update
2020 年 4 月 14 日
Addendum to APCN173705A - Planned Qualifications of Fab 25 and SMIC Fab B1 as Additional Wafer Fab Sites and a New Bill of Materials at J-Devices for Select MCU and Analog Products

Product Information Notice (PIN) (2)

2020 年 4 月 14 日
Company Name Change from J-Devices Corporation to Amkor Technology Japan, Inc.
2020 年 3 月 25 日
Company Name Changed from Mie Fujitsu Semiconductor Limited (MIFS) to United Semiconductor Japan Co., Ltd (USJC)