CYP15G0101DXB-BBXC | 赛普拉斯半导体

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CYP15G0101DXB-BBXC
Status: 生产中

数据手册

(pdf, 1003.01 KB) RoHS PB Free

CYP15G0101DXB-BBXC

8B / 10B ENDEC
合格汽车
FunctionsTransceiver
最高工作温度 (°C)70
最高工作电压 (V)3.60
Max. Speed (Mbps)1500
最低工作温度 (°C)0
最低工作电压 (V)3.00
Min. Speed (Mbps)195
No. of Channels1
StandardSMPTE / DVBASI
Tape & Reel

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
联系销售人员
Availability Quantity Ships In Buy from Cypress Buy from Distributors
In Stock 50 24-48 hours

Packaging/Ordering

工具包
BGA
No. of Pins
100
Package Dimensions
435 L x 1.4 H x 435 W (Mils)
Package Weight
266.60 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
1760
Minimum Order Quantity (MOQ)
176
Order Increment
176
Estimated Lead Time (days)
182
HTS Code
8542.39.0001
ECCN
B.1
ECCN Suball
5A991

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
符合有害物质限制 (RoHS) 标准
无铅
Lead/Ball Finish
Sn/Ag/Cu

Package Qualification Report

技术文档

应用笔记 (22)

2017 年 7 月 05 日

产品变更通知 (PCN) (6)

2018 年 5 月 28 日
Improve Moisture Sensitivity Level of FBGA Pb-Free Products
2018 年 5 月 28 日
Qualification of Advanced Interconnect Technologies (AIT), as an alternate assembly site for 100 ball 11x11x1.4mm BGA Packages Using SnAgCu Solder Balls
2018 年 5 月 27 日
Shipping Label Upgrade
2017 年 10 月 31 日
Q2, 2012 - Q4, 2013 Horizon Report
2017 年 10 月 30 日
Q1, 2012 - Q2, 2013 Horizon Report
2017 年 10 月 24 日
Qualification of Copper Wire Bonds for Ball Grid Array (BGA) Products

Product Information Notice (PIN) (4)

2020 年 7 月 28 日
USB Products Failure Analysis Policy Change
2020 年 6 月 10 日
Manufacturing Label and Packing Configuration Standardization
2020 年 4 月 14 日
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization
2017 年 11 月 06 日
Changes to Cypress Address Labels