CYUSB2014-BZXI | 赛普拉斯半导体

CYUSB2014-BZXI
Status: 生产中

数据手册

(pdf, 1.37 MB) RoHS PB Free
(pdf, 1.15 MB) RoHS PB Free
(pdf, 1.1 MB) RoHS PB Free

CYUSB2014-BZXI

Development KitCYUSB3KIT-001
应用USB HighSpeed Peripherals
合格汽车
CPU CoreARM926 EJ-S
数据传输批量,中断,同步
I/O 选项8/16/32-bit GPIF, DMA, GPIO, I2C, UART, I2S, SPI
最高工作温度 (°C)85
最高工作电压 (V)1.25
存储器架构SRAM
存储器大小 (KB)512
最低工作温度 (°C)-40
最低工作电压 (V)1.15
No. of Endpoints32
I/O 数目60
软件工具EZ-USB FX3 SDK and GPIF II Designer
Tape & Reel

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$17.82 $14.26 $13.39 $12.42 $11.88 $11.34
Availability Quantity Ships In Buy from Cypress Buy from Distributors
In Stock 117 24-48 hours

Packaging/Ordering

No. of Pins
121
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
168
Minimum Order Quantity (MOQ)
168
Order Increment
168
Estimated Lead Time (days)
84
HTS Code
8542.31.0001
ECCN
(A.3)
ECCN Suball
3A991.A.3

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
符合有害物质限制 (RoHS) 标准
无铅
Lead/Ball Finish
Sn/Ag/Cu

Device Qualification Reports

FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.

技术文档

应用笔记 (12)

产品变更通知 (PCN) (3)

2020 年 5 月 07 日
Qualification of BKK as an additional assembly site for select 48 & 121 ball grid array (BGA)
2020 年 4 月 14 日
Serial Number Addition to Top Mark for Select Flash and SRAM Parts at Cypress Bangkok
2017 年 11 月 09 日
Planned Qualification of Spansion Manufacturing Sites for Cypress Products

Product Information Notice (PIN) (3)

2020 年 7 月 28 日
USB Products Failure Analysis Policy Change
2020 年 6 月 10 日
Manufacturing Label and Packing Configuration Standardization
2020 年 4 月 14 日
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization