CYW20706UA2KFFB4GT | 赛普拉斯半导体
CYW20706UA2KFFB4GT
| Automotive Grade | 否 |
| 合格汽车 | 否 |
| Bluetooth Specification | Bluetooth 5.0 |
| CPU Core | ARM Cortex M3 |
| Co-existence Interface | GCI SECI |
| Cypress Module Area (mm) | 无 |
| Dedicated ADC (Max. Resolution @ Sampling Rate) | 10-bit @ 100 KHz (Static) 13-bit @ 16 KHz (Audio) |
| Device Type | Silicon |
| Interfaces | 2 UART, 2 SPI, I2C, PCM, I2S |
| 最高工作频率 (MHz) | 96 |
| 最高工作温度 (°C) | 85 |
| 最高工作电压 (V) | 3.60 |
| 最低工作温度 (°C) | -30 |
| 最低工作电压 (V) | 3.00 |
| Module Features | 无 |
| GPIO 编号 | 24 |
| Partner Modules Available | 是 |
| Power-Class | Class 1, Class 2 |
| Product Family | BCM20706 |
| RAM (KB) | 352 |
| Silicon Features | Infrared TX |
| Software Support | WICED |
| Tape & Reel | 是 |
| Wireless Technology | Bluetooth (BR + EDR + BLE) |
Pricing & Inventory Availability
| 1-9 unit Price* | 10-24 unit Price* | 25-99 unit Price* | 100-249 unit Price* | 250-999 unit Price* | 1000+ unit Price* |
|---|---|---|---|---|---|
| 联系销售人员 | |||||
Packaging/Ordering
Quality and RoHS
Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
260 (Cypress Reflow Profile)
符合有害物质限制 (RoHS) 标准
无铅
是
Lead/Ball Finish
Sn/Ag/Cu;Sn/Ag;Sn/Ag/Cu/Ni
Marking
技术文档
应用笔记 (25)
2020 年 6 月 03 日
2020 年 6 月 02 日
2020 年 6 月 02 日
2020 年 6 月 02 日
产品变更通知 (PCN) (2)
2020 年 5 月 6 日
Qualification of PTI Singapore (PTI-SG) as an Additional Bumping Site for Select Plated Bump WLCSP Products
2020 年 4 月 14 日
Qualification of Cypress Thailand as an Additional Assembly Site and PTI-SG as an Additional Wafer Bumping Site for Select 49-Ball Flip Chip BGA (FCBGA) IoT Products
Advanced Product Change Notice (APCN) (3)
Product Information Notice (PIN) (4)
2020 年 4 月 14 日
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization
2020 年 4 月 14 日
CVE-2018-19860 - Vulnerability in Certain Cypress Bluetooth Controllers Containing Certain Firmware Versions
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