FM24C16B-G | 赛普拉斯半导体
FM24C16B-G
| Development Kit | 否 |
| 合格汽车 | 否 |
| 密度 (Kb) | 16 |
| 频率 (MHz) | 1 |
| 接口 | I2C |
| 最高工作温度 (°C) | 85 |
| Max. Operating VCCQ (V) | 5.50 |
| 最高工作电压 (V) | 5.50 |
| 最低工作温度 (°C) | -40 |
| Min. Operating VCCQ (V) | 4.50 |
| 最低工作电压 (V) | 4.50 |
| 组织 (X x Y) | 2Kb x 8 |
| Part Family | Serial FRAM |
| 速率 (ns) | 0 |
| Tape & Reel | 否 |
| 温度分类 | 工业 |
Pricing & Inventory Availability
| 1-9 unit Price* | 10-24 unit Price* | 25-99 unit Price* | 100-249 unit Price* | 250-999 unit Price* | 1000+ unit Price* |
|---|---|---|---|---|---|
| $1.52 | $1.28 | $1.14 | $1.00 | $0.95 | $0.90 |
Packaging/Ordering
Quality and RoHS
Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
260 (Cypress Reflow Profile)
符合有害物质限制 (RoHS) 标准
无铅
是
Lead/Ball Finish
Pure Sn
Marking
技术文档
产品变更通知 (PCN) (6)
2020 年 12 月 07 日
Qualification of Greatek as an Additional Assembly Site for Select 8-Lead SOIC Package on FRAM Products
2020 年 10 月 05 日
Addendum to PCN201502*A - Qualification of Fab 25 as an Alternate Wafer Fab Site and a Bond Wire Change for Industrial-Grade 4Kb, 16Kb and 64Kb F-RAM Products
2020 年 4 月 26 日
Addendum to PCN201502 - Qualification of Fab 25 as an Alternate Wafer Fab Site and a Bond Wire Change for Industrial-Grade 4Kb, 16Kb and 64Kb F-RAM Products
2020 年 4 月 14 日
Qualification of Texas Instruments’ DMOS6 as an Additional Wafer Fab Site, Cypress’ Test 25 as an Additional Wafer Sort Site and Copper Palladium Wires for Select 64Kb/16Kb/4Kb F-RAM Serial Industrial-grade Products.
2020 年 4 月 09 日
Qualification of Fab 25 as an Alternate Wafer Fab Site and a Bond Wire Change for Industrial-Grade 4Kb, 16Kb and 64Kb F-RAM
2017 年 10 月 25 日
Standardization of Moisture Sensitive Level (MSL) Classification for F-RAM Products
Advanced Product Change Notice (APCN) (5)
Product Information Notice (PIN) (9)
2020 年 4 月 14 日
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization
2020 年 4 月 14 日
VDD Power-Down Ramp Rate (tVF) Specification Change in the Datasheet for Select F-RAM Devices
2017 年 11 月 06 日
Qualification of Cypress Minnesota as Wafer Sort facility for F-RAM Products
2017 年 11 月 06 日
Changes to F-RAM Minimum Order Quantities, Order Increments, and Factory Order Increments to Align with Cypress Standards
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