FM25VN10-G | 赛普拉斯半导体

FM25VN10-G
Status: 生产中

数据手册

(pdf, 1.04 MB) RoHS PB Free

FM25VN10-G

Development Kit
合格汽车
密度 (Kb)1024
频率 (MHz)40
接口SPI
最高工作温度 (°C)85
Max. Operating VCCQ (V)3.60
最高工作电压 (V)3.60
最低工作温度 (°C)-40
Min. Operating VCCQ (V)2.00
最低工作电压 (V)2.00
组织 (X x Y)128Kb x 8
Part FamilySerial FRAM
速率 (ns)0
Tape & Reel
温度分类工业

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$14.92 $13.35 $12.01 $10.60 $10.28 $9.89
Availability Quantity Ships In Buy from Cypress Buy from Distributors
In Stock 50 24-48 hours

Packaging/Ordering

No. of Pins
8
Package Cross Section Drawing
Package Carrier
TUBE
Package Carrier Drawing / Orientation
Standard Pack Quantity
194
Minimum Order Quantity (MOQ)
194
Order Increment
194
Estimated Lead Time (days)
56
HTS Code
8542.32.0071
ECCN
ECCN Suball
EAR99

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
符合有害物质限制 (RoHS) 标准
无铅
Lead/Ball Finish
Pure Sn

Device Qualification Reports

FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.

技术文档

产品变更通知 (PCN) (3)

2020 年 4 月 14 日
Addendum to PCN 173903: Qualification of Texas Instruments’ DMOS 6 as an Additional Wafer Fab Site, Cypress’s Test 25 as an Additional Wafer Sort Site, and Copper-Palladium Wire for Select 512kb/1Mb Serial F-RAM Industrial-Grade Products
2020 年 4 月 14 日
Qualification of Texas Instruments’ DMOS 6 as an Additional Wafer Fab Site, Cypress’s Test 25 as an Additional Wafer Sort Site, and Copper-Palladium Wire for Select 512kb/1Mb Serial F-RAM Industrial-Grade Products
2017 年 10 月 25 日
Standardization of Moisture Sensitive Level (MSL) Classification for F-RAM Products

Advanced Product Change Notice (APCN) (3)

2020 年 4 月 22 日
Q220 Standard Horizon Report Update
2020 年 4 月 14 日
2020 Annual Horizon Report Update
2020 年 4 月 14 日
Q419 Horizon Report Update

Product Information Notice (PIN) (7)

2020 年 6 月 10 日
Manufacturing Label and Packing Configuration Standardization
2020 年 4 月 14 日
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization
2017 年 11 月 07 日
Qualification of an Additional Top Passivation Layer for F-RAM Devices
2017 年 11 月 06 日
Changes to Cypress Address Labels
2017 年 11 月 06 日
F-RAM PRODUCTS DATASHEET FORMAT CHANGES
2017 年 11 月 06 日
Changes to F-RAM Minimum Order Quantities, Order Increments, and Factory Order Increments to Align with Cypress Standards
2017 年 11 月 06 日
Changes to F-RAM Marking to Align with Cypress Standards

Verilog (1)

2020 年 4 月 28 日

IBIS (1)

2014 年 7 月 03 日