MB9BF366RBGL-GK7E1 | 赛普拉斯半导体

MB9BF366RBGL-GK7E1

合格汽车
最高工作温度 (°C)70
最高工作电压 (V)5.50
最低工作温度 (°C)0
最低工作电压 (V)2.70
Tape & Reel

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
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Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

No. of Pins
144
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
1
Minimum Order Quantity (MOQ)
416
Order Increment
416
Estimated Lead Time (days)
182
HTS Code
8542.31.0000
ECCN Suball
3A991.A

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
符合有害物质限制 (RoHS) 标准
无铅
Lead/Ball Finish
Sn-3Ag-0.5Cu

Device Qualification Reports

FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.

技术文档

应用笔记 (13)

产品变更通知 (PCN) (1)

2020 年 4 月 28 日
Marketing Part Number Change for Select MCU and Analog Products

Advanced Product Change Notice (APCN) (1)

2020 年 4 月 14 日
Planned Qualifications of Fab 25 and SMIC Fab B1 as Additional Wafer Fab Sites and a New Bill of Materials at J-Devices for Select MCU and Analog Products

Product Information Notice (PIN) (2)

2020 年 4 月 14 日
Company Name Change from J-Devices Corporation to Amkor Technology Japan, Inc.
2020 年 3 月 25 日
Company Name Changed from Mie Fujitsu Semiconductor Limited (MIFS) to United Semiconductor Japan Co., Ltd (USJC)