S29GL512S10TFA010 | 赛普拉斯半导体
S29GL512S10TFA010
合格汽车 | 是 |
Density (Mbit) | 512 |
Initial Access Time (ns) | 100 |
接口 | Parallel |
Interface Frequency (SDR / DDR) (MHz) | NA |
最高工作温度 (°C) | 85 |
最高工作电压 (V) | 3.60 |
最低工作温度 (°C) | -40 |
最低工作电压 (V) | 2.70 |
Operating Voltage (V) | 3 |
Page Access Time (ns) | 15 |
Part Family | Parallel NOR |
Series | GL-S |
Tape & Reel | 否 |
Temperature Range (Min C to Max C) | -40C to +85C |
Pricing & Inventory Availability
1-9 unit Price* | 10-24 unit Price* | 25-99 unit Price* | 100-249 unit Price* | 250-999 unit Price* | 1000+ unit Price* |
---|---|---|---|---|---|
$10.93 | $9.19 | $8.20 | $7.21 | $6.81 | $6.36 |
Packaging/Ordering
Quality and RoHS
Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
260 (Cypress Reflow Profile)
符合有害物质限制 (RoHS) 标准
是
无铅
是
Lead/Ball Finish
Matte Tin Plating
Marking
Device Qualification Reports
FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.
Last Update: 2017 年 5 月 16 日
技术文档
应用笔记 (25)
2021 年 3 月 03 日
2021 年 3 月 02 日
产品变更通知 (PCN) (2)
2020 年 4 月 14 日
Qualification of XMC as an Additional Wafer Fab Site for Automotive GL-S NOR Flash Memory Products
2020 年 4 月 07 日
Qualification of Tera Probe, Inc. Japan as an Additional Wafer Sort Site for Flash NOR GL01GS and GL512S Product
Advanced Product Change Notice (APCN) (3)
Product Information Notice (PIN) (1)
2020 年 4 月 14 日
Qualification of WXIC, China as an Additional Wafer Foundry Site for 65nm GL-S MirrorBit® Eclipse Flash Memory Products