S29GL512S12TFBV10 | 赛普拉斯半导体

S29GL512S12TFBV10
Status: 生产中

数据手册

(pdf, 2.33 MB) RoHS PB Free

S29GL512S12TFBV10

合格汽车
Density (Mbit)512
Initial Access Time (ns)120
接口Parallel
Interface Frequency (SDR / DDR) (MHz)NA
最高工作温度 (°C)105
最高工作电压 (V)3.60
最低工作温度 (°C)-40
最低工作电压 (V)2.70
Operating Voltage (V)3
Page Access Time (ns)15
Part FamilyParallel NOR
SeriesGL-S
Tape & Reel
Temperature Range (Min C to Max C)-40C to +105C

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$12.76 $10.73 $9.57 $8.41 $7.95 $7.42
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

No. of Pins
56
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
910
Minimum Order Quantity (MOQ)
91
Order Increment
91
Estimated Lead Time (days)
364
HTS Code
8542.32.0051
ECCN Suball
3A991.B.1.A

Quality and RoHS

Moisture Sensitivity Level (MSL)
Peak Reflow Temp. (°C)
符合有害物质限制 (RoHS) 标准
无铅
Lead/Ball Finish
Matte Tin Plating

Device Qualification Reports

FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.

Last Update: 2017 年 5 月 16 日

技术文档

应用笔记 (25)

2021 年 4 月 05 日

产品变更通知 (PCN) (2)

2020 年 4 月 14 日
Qualification of XMC as an Additional Wafer Fab Site for Automotive GL-S NOR Flash Memory Products
2020 年 4 月 07 日
Qualification of Tera Probe, Inc. Japan as an Additional Wafer Sort Site for Flash NOR GL01GS and GL512S Product

Advanced Product Change Notice (APCN) (3)

2020 年 7 月 21 日
Q32020 Automotive Horizon Report Update
2020 年 4 月 22 日
Q220 Automotive Horizon Report Update
2020 年 4 月 14 日
Q419 Automotive Horizon Report Update

Product Information Notice (PIN) (1)

2020 年 4 月 14 日
Qualification of WXIC, China as an Additional Wafer Foundry Site for 65nm GL-S MirrorBit® Eclipse Flash Memory Products