SL811HST-AXC | 赛普拉斯半导体

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SL811HST-AXC
Status: 生产中

数据手册

(pdf, 643.54 KB) RoHS PB Free

SL811HST-AXC

Development Kit
应用USB Embedded Hosts
合格汽车
CPU CoreCY16
数据传输批量,中断,同步
Host Ports0
I/O 选项
最高工作温度 (°C)70
最高工作电压 (V)3.45
存储器架构ROM/RAM
存储器大小 (KB)256
最低工作温度 (°C)0
最低工作电压 (V)3.00
No. of Endpoints4
I/O 数目8
软件工具
Tape & Reel

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$18.14 $15.66 $14.84 $12.37 $12.00 $11.18
Availability Quantity Ships In Buy from Cypress Buy from Distributors
In Stock 70 24-48 hours

Packaging/Ordering

工具包
No. of Pins
48
Package Dimensions
275 L x 1.4 H x 275 W (Mils)
Package Cross Section Drawing
Package Carrier
TRAY
Standard Pack Quantity
1250
Minimum Order Quantity (MOQ)
1250
Order Increment
1250
Estimated Lead Time (days)
126
HTS Code
8542.31.0001
ECCN
(A.3)
ECCN Suball
3A991.A.3

Quality and RoHS

Moisture Sensitivity Level (MSL)
Peak Reflow Temp. (°C)
符合有害物质限制 (RoHS) 标准
无铅
Lead/Ball Finish

技术文档

应用笔记 (2)

开发套件/板 (1)

2018 年 3 月 19 日

产品变更通知 (PCN) (3)

2020 年 5 月 10 日
Addendum 2 Change in Qualification of Copper Wire Bonds for 56SSOP Products at OSE-Taiwan
2018 年 5 月 28 日
Qualification of Pb-Free 100% Pure Tin Lead Finish for SL811HST-AXC Device
2017 年 10 月 24 日
Qualification of Copper Wire Bonds for select Lead Frame (LF) Products