You are here

产品变更通知 | 赛普拉斯半导体


主题 Summary
PTN202703A Addendum to PTN202703 - July 2020 Product Obsolescence Notification
PCN211306 Qualification of Fab 25 as an Additional Wafer Fab Site and Marketing Part Number Change for Select Automotive MCU Products
PCN211301 Qualification of XMC as an Additional Wafer Fab Site for Automotive FL512S NOR Flash Memory Products
PTN211303 January 2021 Product Obsolescence Notification for Memory Solution Products
PCN211305 Qualification of Greatek Electronics an Alternate Assembly Site for Select 44-Lead TSOP II Package Memory Products
PCN211302 Qualification of Cypress Thailand as an Additional Assembly Site and PTI-TW as a New Bumping Site for Select 49-Ball Flip Chip BGA (FCBGA) Package
PCN211203 Qualification of Tera Probe Inc. as a Replacement Wafer Sort Site for 200mm Select Analog and Automotive MCU Products
PCN210502 Qualification of PTI-TW as an Additional Wafer Bump Site for Select UMC Plated Bump Flip Chip FBGA (FCFBGA) IOT Products
PCN211205 Assembly Site and Bill of Materials Information for Select Industrial-Grade 32Mb MoBL® SRAM Product
PCN211204 Qualification of Daewon Tray at ChipMOS Test and Finish Site for 44-Lead TSOP II Package Memory Products