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HyperRAM 2.0 存储器 | 赛普拉斯半导体

HyperRAM 2.0 存储器

Cypress HyperRAM™ 2.0 is a high-speed, low-pin-count, self-refresh Dynamic RAM (DRAM) for high-performance embedded systems requiring expansion memory. HyperRAM 2.0 offers HyperBus™ and Octal SPI interfaces that draw upon the legacy features of both parallel and serial interface memories, while enhancing system performance and ease of design, as well as reducing system cost.

The 12-pin, HyperBus and Octal SPI interfaces operate at Double Data Rate (DDR) and can scale up to 400 MB/s throughput making HyperRAM 2.0 the ideal expansion memory for controllers with limited on-board RAM. When used as a scratch-pad memory, the fast read and write operations enable fast delivery of high-resolution graphics in the early part of the system boot process. HyperRAM 2.0 is the ideal memory for automotive instrument clusters, industrial HMI, industrial machine vision and display systems for consumer electronics.

Product Highlights

  • Offers JEDEC Expanded SPI (xSPI) standard compliant HyperBus and Octal interfaces that are supported by a wide ecosystem of host controllers and memories
  • Offers bandwidth of up to 400 MBps (3,200 Mbps)
  • 64 Mbit and 128 Mbit density options
  • Operating voltage range: 1.7–2.0 V and 2.7–3.6 V
  • Industrial (-40°C to +85°C), Industrial Plus (-40°C to +105°C), Automotive Grade 3 (-40°C to +85°C) and Automotive Grade 2 (-40°C to +105°C) temperature grades
  • AEC-Q100 qualified parts
  • Comes in the industry's smallest 6 mm x 8 mm 24-ball BGA package
  • Shares a common footprint with xSPI flash (HyperBus and Octal interfaces)
  • Offers the industry’s lowest Active Current
  • Provides Hybrid Sleep Mode, Deep Power Down Mode and Partial Memory Array Refresh features to minimize power consumption

Learn about Infineon Products

  1. Watch the Introduction to HyperRAM 2.0 video
  2. Download the HyperRAM 2.0 Datasheets
  3. Download Getting Started with HyperRAM 2.0 Application Notes
  4. Sampling Now! - Order your sample
  5. Get your schematics reviewed by the Cypress Applications Engineering Team using Cypress Developer Community
特性 HyperRAM 2.0
产品选择器指南
Density 64 Mbit and 128 Mbit
Operating Voltage 1.8V

3.0 V
Frequency 200 MHz option for 1.8V and 3.0V devices
166MHz option for 3.0V device
接口 HyperBus and Octal SPI
Temperature Range Industrial, -40°C to +85°C
Industrial Plus, -40°C to 105°C
Automotive Grade 3, -40°C to 85°C
Automotive Grade 2, -40°C to +105°C
Packages 24-ball BGA
Active Current (max) 25 mA (64 Mbit, 1.8V)
30 mA (64 Mbit, 3.0V)
Standby Current (max) 220 µA (64 Mbit, 1.8V)
250 µA (64 Mbit, 3.0V)
Deep Power Down (Max No Refresh Current) 10 µA (64 Mbit, 1.8V)
12 µA (64 Mbit, 3.0V)
Hybrid Sleep (Typ Self Refresh Current) 25 µA (64 Mbit, 1.8V)
35 µA (64 Mbit, 3.0V)
Partial Array Refresh
数据手册

1. Automotive Instrument Cluster

Click here to learn about other Cypress’ solutions for Automotive Instrument Clusters.

Design Challenges

  1. Limited internal video RAM on MCU
  2. Requires memory to support fast bus speeds for smooth graphics rendering
  3. Requires high-reliability low complexity interface
  4. Requires automotive qualified memory

Cypress Solution

  1. 64 Mb and 128 Mb density combinations offering scalability to address increasing graphical complexity of mid- and high-end clusters
  2. Offers 400 MBps read speed for 1.8 V and 3.0 V versions
  3. HyperRAM™ offers simple 12-pin bus that is shareable with HyperFlash™
  4. HyperRAM comes in Automotive Grade 2 temperature grade

2. Displays: Consumer and Industrial HMI

Design Challenges

  1. Limited internal RAM resources on MCU
  2. Small footprint and low pin-count memory
  3. Support fast bus speeds for smooth graphics rendering

Cypress Solution

  1. 64 Mb and 128 Mb density combinations offering scalability to address increasing graphical complexity in displays
  2. Tiny 48 mm2 (6 mm x 8 mm) 24-pin package with 12 signal pins
  3. Offers 400 MBps read speed at 1.8 V