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HyperRam™ & Octal xSPI RAM | 赛普拉斯半导体

HyperRam™ & Octal xSPI RAM

HyperRAM™ is a high-speed, low-pin-count, low-power self-refresh Dynamic RAM (DRAM) for high-performance embedded systems requiring expansion memory. HyperRAM™ offers JEDEC compliant HyperBus™ and Octal SPI interfaces that draw upon the legacy features of both parallel and serial interface memories, while enhancing system performance and ease of design, as well as reducing system cost. HyperRAM the ideal scratchpad/buffering off-chip memory for controllers with limited on-board RAM such as automotive instrument clusters, industrial HMI, industrial machine vision and display systems for consumer electronics.

  HyperRAM™ Octal xSPI RAM
Family Series Gen 1.0 | KL-1/KS-1 Gen 2.0 | KL-2/KS-2 KL-3/KS-3
接口 X8 HyperBus x8 HyperBus x8 Octal xSPI
Density 64Mb, 128Mb

64Mb, 128Mb,

256Mb (New!), 512Mb (New!)

64Mb, 128Mb,

256Mb (New!), 512Mb (New!)

Throughput 333 MBps 400 MBps 400 MBps
工具包 48 mm2, 24-ball BGA 48 mm2, 24-ball BGA 48 mm2, 24-ball BGA
产品选择器指南

HyperBus utilizes a high-speed 8-bit DDR interface for both address and data. In addition, it uses a differential clock, a read/write latch signal, and a chip select for each memory device. HyperBus supports external flash and RAM on the same bus, and works with any microcontroller with a HyperBus compatible peripheral interface.

For more details on how the HyperRAM™ provides a low-pin expansion memory solution, read this whitepaper.

Small Form Factor

Small Form Factor

48 mm2 24-ball FBGA package ensure small footprint

Low Pin-Count

Low Pin-Count

Low pin-count ensures design simplicity and reduced system cost

低功耗

低功耗

Low power consumption with multiple low-power for energy efficiency

High Throughput

High Throughput

High read/write bandwidth maximizes system performance

Learn about Infineon Products

  1. Watch the Introduction to HyperRAM™ 2.0 video
  2. Read:
  3. Get and overview of the product features
  4. Understand the product applications
  5. Download the Datasheets for:
    • Octal xSPI RAM
    • HyperRAM™ 2.0
  6. Read:
  7. Use the Product Selector to select the appropriate product
  8. Order your sample
  9. Get your schematics reviewed by the Cypress Applications Engineering Team using Cypress Developer Community
特性 HyperRAM™ 1.0 (KL-1/KS-1) HyperRAM™ 2.0 (KL-2/KS-2) Octal xSPI RAM (KL-3/KS-3)
产品选择器指南
Density 64Mb, 128Mb 64Mb, 128Mb, 256Mb, 512Mb 64Mb, 128Mb, 256Mb, 512Mb
Operating Voltage

1.8V

3.0V

1.8V

3.0V (only 64Mb, 128Mb)

1.8V

3.0V (only 64Mb, 128Mb)

接口

HyperBus

(JEDEC JESD251 Profile 2.0)

HyperBus

(JEDEC JESD251 Profile 2.0)

Octal xSPI

(JEDEC JESD251 Profile 1.0)

Data Bus Width 8-bit (x8) 8-bit (x8) 8-bit (x8)
Frequency, Throughput   200 Mhz, 400 MBps 200 MHz, 400 MBps
Temperature Range

Industrial, -40°C to +85°C

Industrial Plus, -40°C to 105°C

Automotive Grade 3, -40°C to 85°C

Automotive Grade 2, -40°C to +105°C

Industrial, -40°C to +85°C

Industrial Plus, -40°C to 105°C

Automotive Grade 3, -40°C to 85°C

Automotive Grade 2, -40°C to +105°C

Automotive Grade 1, -40°C to +125°C

Industrial, -40°C to +85°C

Industrial Plus, -40°C to 105°C

Automotive Grade 3, -40°C to 85°C

Automotive Grade 2, -40°C to +105°C

Packages 48mm2, 24-ball BGA 48mm2, 24-ball BGA 48mm2, 24-ball BGA
Active Current (max) 60 mA (1.8V), 35 mA (3.0V) 25 mA (1.8V), 30 mA (3.0V) 25 mA (1.8V), 30 mA (3.0V)
Standby Current (max) 200 μA (1.8V), 300 μA (3.0V) 220 μA (1.8V), 250 μA (3.0V) 220 μA (1.8V), 250 μA (3.0V)
Deep Power Down (Max No Refresh Current) 10 μA (1.8V), 20 μA (3.0V) 10 μA (1.8V), 12 μA (3.0V) 10 μA (1.8V), 12 μA (3.0V)
Hybrid Sleep (Typ. Self Refresh Current) NA 25 μA (1.8V), 35 μA (3.0V) 25 μA (1.8V), 35 μA (3.0V)
Partial Array Refresh
数据手册

1. Automotive Instrument Cluster

Click here to learn about other Cypress’ solutions for Automotive Instrument Clusters.

Design Challenges

  1. Limited internal video RAM on MCU
  2. Requires memory to support fast bus speeds for smooth graphics rendering
  3. Requires high-reliability low complexity interface
  4. Requires automotive qualified memory

Cypress Solution

  1. 64 Mb and 128 Mb density combinations offering scalability to address increasing graphical complexity of mid- and high-end clusters
  2. Offers 400 MBps read speed for 1.8 V and 3.0 V versions
  3. HyperRAM™ offers simple 12-pin bus that is shareable with HyperFlash™
  4. HyperRAM comes in Automotive Grade 2 temperature grade

2. Displays: Consumer and Industrial HMI

Design Challenges

  1. Limited internal RAM resources on MCU
  2. Small footprint and low pin-count memory
  3. Support fast bus speeds for smooth graphics rendering

Cypress Solution

  1. 64 Mb and 128 Mb density combinations offering scalability to address increasing graphical complexity in displays
  2. Tiny 48 mm2 (6 mm x 8 mm) 24-pin package with 12 signal pins
  3. Offers 400 MBps read speed at 1.8 V

3. Industrial Machine Vision Camera

Design Challenges

  1. Limited internal RAM resources on FPGA
  2. Low pin-count external memory required
  3. 400-MBps throughput requireent
  4. Gate-count efficient IP for external memory interface

Cypress Solution

  1. 64Mb -512Mb density options that meet expansion RAM needs
  2. 24-Pin package with 12 signal pins
  3. 400-MBps read speed at 1.8 V
  4. Availability of optimized IP for leading FPGA platforms